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| DATA SHEET GaAs INTEGRATED CIRCUIT PG2008TB L, S-BAND SPDT SWITCH DESCRIPTION The PG2008TB is an L, S-band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital cellular, cordless telephone and other L, S-band wireless application. The device can operate from 500 MHz to 2.5 GHz, having the low insertion loss. It housed in an original 6-pin super minimold package that is smaller than usual 6-pin minimold easy to install and contributes to miniaturizing the system. FEATURES * Low insertion loss * High isolation : LINS = 0.3 dB TYP. @ Vcont = +3.0 V/0 V, f = 1 GHz LINS = 0.4 dB TYP. @ Vcont = +3.0 V/0 V, f = 2 GHz : ISL = 27 dB TYP. @ Vcont = +3.0 V/0 V, f = 0.5 to 2.0 GHz * 6-pin super minimold package (2.0 x 1.25 x 0.9 mm) APPLICATION * L, S-band digital cellular or cordless telephone * BuletoothTM, W-LAN and WLL applications ORDERING INFORMATION Part Number Package 6-pin super minimold Marking G3D Supplying Form * Embossed tape 8 mm wide * Pin 1, 2, 3 face the perforation side of the tape * Qty 3 kpcs/reel PG2008TB-E3 Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PG2008TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PG10193EJ01V0DS (1st edition) Date Published November 2002 CP(K) Printed in Japan (c) NEC Compound Semiconductor Devices 2002 PG2008TB PIN CONNECTIONS Pin No. Pin Name OUT1 GND OUT2 Vcont2 IN Vcont1 (Top View) (Bottom View) 1 4 5 6 4 5 6 3 2 G3D 3 2 1 2 3 4 1 5 6 ABSOLUTE MAXIMUM RATINGS (TA = +25C, unless otherwise specified) Parameter Control Voltage 1, 2 Input Power Total Power Dissipation Operating Ambient Temperature Storage Temperature Symbol Vcont1, 2 Pin Ptot TA Tstg Ratings -6.0 to +6.0 Note +28 0.15 -45 to +85 -55 to +150 Unit V dBm W C C Note Vcont1-Vcont2 6.0 V RECOMMENDED OPERATING RENGE (TA = +25C) Parameter Control Voltage (High) Control Voltage (Low) Symbol Vcont(H) Vcont(L) MIN. +2.5 -0.2 TYP. +3.0 0 MAX. +5.3 +0.2 Unit V V 2 Data Sheet PG10193EJ01V0DS PG2008TB ELECTRICAL CHARACTERISTICS (TA = +25C, Vcont1 = +3 V, Vcont2 = 0 V or Vcont1 = 0 V, Vcont2 = +3 V, ZO = 50 , Off chip DC blocking capacitors value; 51 pF, unless otherwise specified) Parameter Insertion Loss Symbol LINS Test Conditions f = 0.5 to 1.0 GHz f = to 2.0 GHz f = to 2.5 GHz Isolation ISL f = 0.5 to 2.0 GHz f = to 2.5 GHz Input Return Loss RLin f = 0.5 to 2.0 GHz f = to 2.5 GHz Output Return Loss RLout f = 0.5 to 2.0 GHz f = to 2.5 GHz Input Power at 0.1 dB Compression Point Note MIN. - - - 22 18 13 11 13 11 - TYP. 0.30 0.40 - 27 - 19 - 19 - 23.0 MAX. 0.55 0.65 0.90 - - - - - - - Unit dB dB dB dB dB dB dB dB dB dBm Pin(0.1 dB) f = 1.0 GHz, Vcont = +3 V/0 V Input Power at 1 dB Compression Point Switching Speed Control Current Note Pin(1 dB) f = 1.0 GHz, Vcont = +3 V/0 V 22.0 26.5 - dBm tSW Icont Vcont = +3 V/0 V, RF Non - - 50 0.5 200 10 ns A Note Pin(0.1 dB) or Pin(1 dB) is measured the input power level when the insertion loss increase more 0.1 dB or 1 dB than that of linear range. All other characteristics are measured in linear range. Cautions 1. When the PG2008TB is used it is necessary to use DC blocking capacitors for No.1 (OUT1), No.3 (OUT2) and No.5 (IN). The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF. 2. The distance between IC's GND pin and ground pattern of substrate should be as shorter as possible to avoid parasitic parameters. Data Sheet PG10193EJ01V0DS 3 PG2008TB EVALUATION CIRCUIT Vcont1 = 3.0 V, Vcont2 = 0 V or Vcont2 = 0 V, Vcont1 = 3.0 V, off chip DC blocking capacitors value C1 = 51 pF, C2 = 1 000 pF (Bypass), using NEC standard evaluation board. C2 C1 G3D Vcont1 6 1 OUT1 IN C1 Vcont2 C2 5 2 4 3 C1 OUT2 EVALUATION BOARD Vcont1 6pin SMM SPDT SW Vc1 OUT1 OUT 1 C2 C1 G3D IN IN C1 C1 C2 OUT 2 OUT2 Vc2 Vcont2 TRUTH TABLE Vcont1 Low High Vcont2 High Low IN-OUT1 ON OFF IN-OUT2 OFF ON 4 Data Sheet PG10193EJ01V0DS PG2008TB TYPICAL CHARACTERISTICS TEST CONDITION: TA = +25C, Vcont1/2 = 0 V/3.0 V, Pin = 0 dBm, OUT2 side is 50 termination INPUT RETURN LOSS vs. FREQUENCY CH1 S11 log MAG 10 dB/ REF 0 dB 1: -22.234 dB 1.0 GHz 2: -27.13 dB 1.5 GHz 3: -30.052 dB 2.0 GHz 4: -24.396 dB 2.5 GHz 5: -16.767 dB 3.0 GHz CH1 S21 ISOLATION vs. FREQUENCY log MAG 10 dB/ REF 0 dB 1: -25.638 dB 1.0 GHz 2: -25.607 dB 1.5 GHz 3: -24.781 dB 2.0 GHz 4: -22.34 dB 2.5 GHz 5: -19.074 dB 3.0 GHz Input Return Loss RLin (dB) Isolation ISL (dB) 0 1 0 1 2 -40 3 4 -20 5 2 4 3 STOP 3.500 000 000 GHz -20 5 -40 START 0.500 000 000 GHz START 0.500 000 000 GHz STOP 3.500 000 000 GHz Frequency f (GHz) Frequency f (GHz) INSERTION LOSS vs. FREQUENCY CH1 S21 log MAG 1 dB/ REF 0 dB 1: -0.660 dB 1.0 GHz 2: -0.771 dB 1.5 GHz 3: -0.892 dB 2.0 GHz 4: -1.047 dB 2.5 GHz 5: -1.340 dB 3.0 GHz OUTPUT RETURN LOSS vs. FREQUENCY CH1 S22 log MAG 10 dB/ REF 0 dB 1: -21.598 dB 1.0 GHz 2: -24.054 dB 1.5 GHz 3: -25.127 dB 2.0 GHz 4: -23.43 dB 2.5 GHz 5: -17.219 dB 3.0 GHz 0 1 2 3 4 Output Return Loss RLout (dB) Insertion Loss LINS (dB) 0 1 -20 2 -40 START 0.500 000 000 GHz -2.0 5 5 3 4 -4.0 START 0.500 000 000 GHz STOP 3.500 000 000 GHz STOP 3.500 000 000 GHz Frequency f (GHz) Frequency f (GHz) Data Sheet PG10193EJ01V0DS 5 PG2008TB TEST CONDITION: TA = +25C, f = 1 GHz, Vcont1/2 = 0 V3.0 V, OUT2 side is termination INPUT POWER vs. OUTPUT POWER 30 Output Power Pout (dBm) 25 20 15 10 5 10 15 20 25 30 P-1 = +26.4 dBm Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. 6 Data Sheet PG10193EJ01V0DS PG2008TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.10.1 1.250.1 2.00.2 1.3 0.65 0.65 0.1 MIN. 0.90.1 0.7 0 to 0.1 0.15+0.1 -0.05 0.2+0.1 -0.05 Data Sheet PG10193EJ01V0DS 7 PG2008TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (package surface temperature) Time at temperature of 200C or higher Preheating time at 120 to 150C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (molten solder temperature) Time at peak temperature Preheating temperature (package surface temperature) Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 215C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below : 260C or below : 10 seconds or less : 120C or below : 1 time : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below Condition Symbol IR260 For soldering VPS VP215 Wave Soldering WS260 Partial Heating HS350 Caution Do not use different soldering methods together (except for partial heating). 8 Data Sheet PG10193EJ01V0DS PG2008TB Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. * The information in this document is current as of November 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 Data Sheet PG10193EJ01V0DS 9 PG2008TB SAFETY INFORMATION ON THIS PRODUCT Caution GaAs Products The product contains gallium arsenide, GaAs. GaAs vapor and powder are hazardous to human health if inhaled or ingested. * Do not destroy or burn the product. * Do not cut or cleave off any part of the product. * Do not crush or chemically dissolve the product. * Do not put the product in the mouth. Follow related laws and ordinances for disposal. The product should be excluded from general industrial waste or household garbage. Business issue NEC Compound Semiconductor Devices, Ltd. 5th Sales Group, Sales Division TEL: +81-3-3798-6372 FAX: +81-3-3798-6783 E-mail: salesinfo@csd-nec.com NEC Compound Semiconductor Devices Hong Kong Limited Hong Kong Head Office FAX: +852-3107-7309 TEL: +852-3107-7303 Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Korea Branch Office FAX: +82-2-528-0302 TEL: +82-2-528-0301 NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-01 FAX: +49-211-6503-487 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 Technical issue NEC Compound Semiconductor Devices, Ltd. http://www.csd-nec.com/ Sales Engineering Group, Sales Division E-mail: techinfo@csd-nec.com FAX: +81-44-435-1918 0209 |
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